Organic light-emitting apparatus and method of manufacturing the same

ABSTRACT

A method of manufacturing an organic light-emitting display apparatus includes: forming a lift-off layer on a substrate including a first electrode, the lift-off layer including a fluoropolymer; forming a pattern layer on the lift-off layer; etching the lift-off layer between patterns of the pattern layer by utilizing a first solvent to expose the first electrode; forming an organic functional layer on the first electrode and the pattern layer, the organic functional layer including an emission layer; removing remaining portions of the lift-off layer by utilizing a second solvent; and forming a second electrode on the organic functional layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/894,631, filed Jun. 5, 2020, which is a continuation of U.S. patentapplication Ser. No. 16/287,852, filed Feb. 27, 2019, now U.S. Pat. No.10,680,212, which is a continuation of U.S. patent application Ser. No.15/410,479, filed Jan. 19, 2017, now U.S. Pat. No. 10,243,175, whichclaims priority to and the benefit of Korean Patent Application No.10-2016-0012908, filed Feb. 2, 2016 and Korean Patent Application No.10-2017-0002068, filed Jan. 5, 2017, the entire content of all of whichis incorporated herein by reference.

BACKGROUND 1. Field

One or more aspects of example embodiments relate to an organiclight-emitting display apparatus and a method of manufacturing anorganic light-emitting display apparatus.

2. Description of the Related Art

An organic light-emitting display apparatus includes a hole injectionelectrode, an electron injection electrode, and an organic emissionlayer between the hole injection electrode and the electron injectionelectrode. The organic light-emitting display apparatus is aself-emissive display apparatus, in which holes injected from the holeinjection electrode and electrons injected from the electron injectionelectrode recombine in the organic emission layer and extinguish to emitlight. The organic light-emitting display apparatus is considered as thenext generation display apparatus owing to its high qualitycharacteristics, such as low power consumption, high brightness, andfast response speeds.

SUMMARY

One or more aspects of example embodiments are directed toward anorganic light-emitting display apparatus and a method of manufacturingthe organic light-emitting display apparatus, capable of reducingdefects and manufacturing costs.

Additional aspects and features will be set forth in part in thedescription which follows, and in part, will be apparent from thedescription, or may be learned by practice of the presented embodiments.

According to one or more embodiments of the inventive concept, a methodof manufacturing an organic light-emitting display apparatus includes:forming a lift-off layer on a substrate including a first electrode, thelift-off layer including a fluoropolymer; forming a pattern layer on thelift-off layer; etching the lift-off layer between patterns of thepattern layer by utilizing a first solvent to expose the firstelectrode; forming an organic functional layer on the first electrodeand the pattern layer, the organic functional layer including anemission layer; removing remaining portions of the lift-off layer byutilizing a second solvent; and forming a second electrode on theorganic functional layer.

The fluoropolymer may include fluorine of about 20 wt % to about 76 wt%.

The pattern layer may be formed by a printing method.

The pattern layer may include a material having a surface energy that isgreater than a surface energy of the lift-off layer.

The pattern layer may include a non-fluorine based polymer material.

The pattern layer may include a fluorine-based polymer containing lessthan 20 wt % of fluorine.

The pattern layer may include: a first pattern layer including amaterial having a surface energy that is greater than a surface energyof the lift-off layer; and a second pattern layer including a materialhaving a surface energy that is less than the surface energy of thefirst pattern layer.

The first pattern layer may include a non-fluorine based polymermaterial, and the second pattern layer may include a surfactantcontaining fluorine.

The first pattern layer may surround the second pattern layer.

The organic functional layer may further include a hole injection layer,a hole transport layer, an electron transport layer, and/or an electroninjection layer.

The organic functional layer may be formed by a deposition process.

The first solvent may include fluorine.

The second solvent may include fluorine.

When the lift-off layer between patterns of the pattern layer is etched,the lift-off layer may form an undercut profile under the pattern layer.

The method may further include: forming a pixel defining layersurrounding edges of the first electrode.

According to one or more embodiments of the inventive concept, a methodof manufacturing an organic light-emitting display apparatus includes:forming a plurality of first electrodes on a substrate; performing afirst unit process, the performing of the first unit process including:forming a lift-off layer on the substrate including the plurality offirst electrodes, the lift-off layer including a fluoropolymer; forminga pattern layer having a set shape on the lift-off layer; etching thelift-off layer between patterns of the pattern layer by utilizing afirst solvent to expose first first electrodes from among the pluralityof first electrodes; forming a first organic functional layer on thefirst first electrodes and the pattern layer, the first organicfunctional layer including an emission layer; and removing remainingportions of the lift-off layer by utilizing a second solvent; performinga second unit process at least once for forming a second organicfunctional layer on second first electrodes from among the firstelectrodes that are different from the first first electrodes after theperforming of the first unit process, the second organic functionallayer being configured to emit light of a different color from that ofthe first organic function layer; and forming a second electrode afterthe performing of each of the first unit process and the second unitprocess.

The light emitted from the first organic functional layer formed throughthe first unit process and the light emitted from the second organicfunctional layer formed through the second unit process may be mixed togenerate white light.

The forming of the second electrode may include integrally forming thesecond electrode as a common electrode on a plurality of organicfunctional layers.

The method may further include forming an auxiliary cathode on each ofthe first and second organic functional layers respectively formed ineach of the first and second unit processes, before the forming of thesecond electrode.

According to one or more embodiments of the inventive concept, anorganic light-emitting display apparatus includes: a substrate; a firstelectrode on the substrate; an organic functional layer on the firstelectrode, the organic functional layer including an emission layer; anda second electrode on the organic functional layer. An unevenness ofboundary lines of the organic functional layer is greater than anunevenness of boundary lines of the first electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects and features will become apparent and morereadily appreciated from the following description of the embodiments,taken in conjunction with the accompanying drawings in which:

FIG. 1 is a flowchart of a method of manufacturing an organiclight-emitting display apparatus according to an embodiment;

FIG. 2 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by the method of FIG. 1;

FIG. 3 is a schematic cross-sectional view showing a plurality of anodesformed on a substrate in the method of FIG. 1 according to anembodiment;

FIGS. 4A-4E are schematic cross-sectional views illustrating a firstunit process in the method of FIG. 1 according to an embodiment;

FIGS. 5A-5E are schematic cross-sectional views illustrating a secondunit process in the method of FIG. 1 according to an embodiment;

FIGS. 6A-6E are schematic cross-sectional views illustrating a thirdunit process in the method of FIG. 1 according to an embodiment;

FIG. 7 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by a manufacturing method according to anembodiment;

FIG. 8 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by a manufacturing method according to anembodiment;

FIGS. 9A-9B are schematic cross-sectional views illustrating a method offorming a pattern layer, according to an embodiment;

FIG. 10 is a schematic cross-sectional view illustrating a method offorming a pattern layer, according to an embodiment; and

FIGS. 11A-11C are schematic diagrams showing states in which boundarylines of corresponding organic layers are irregularly formed afterfinishing corresponding unit processes.

DETAILED DESCRIPTION

Hereinafter, example embodiments will be described in more detail withreference to the accompanying drawings. The present inventive concept,however, may be embodied in various different forms, and should not beconstrued as being limited to only the illustrated embodiments herein.Rather, these embodiments are provided as examples so that thisdisclosure will be thorough and complete, and will fully convey theaspects and features of the inventive concept to those skilled in theart. Accordingly, processes, elements, and techniques that are notnecessary to those having ordinary skill in the art for a completeunderstanding of the aspects and features of the inventive concept maynot be described. Unless otherwise noted, like reference numerals denotelike elements throughout the attached drawings and the writtendescription, and thus, descriptions thereof may not be repeated.

In the drawings, the relative sizes of elements, layers, and regions maybe exaggerated and/or simplified for clarity. Spatially relative terms,such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and thelike, may be used herein for ease of explanation to describe one elementor feature's relationship to another element(s) or feature(s) asillustrated in the figures. It will be understood that the spatiallyrelative terms are intended to encompass different orientations of thedevice in use or in operation, in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” or “under” otherelements or features would then be oriented “above” the other elementsor features. Thus, the example terms “below” and “under” can encompassboth an orientation of above and below. The device may be otherwiseoriented (e.g., rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein should be interpretedaccordingly.

It will be understood that, although the terms “first,” “second,”“third,” etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondescribed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of theinventive concept.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” or “coupled to” another element or layer, itcan be directly on, connected to, or coupled to the other element orlayer, or one or more intervening elements or layers may be present. Inaddition, it will also be understood that when an element or layer isreferred to as being “between” two elements or layers, it can be theonly element or layer between the two elements or layers, or one or moreintervening elements or layers may also be present.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting of the inventive concept.As used herein, the singular forms “a” and “an” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and “including,” when used in thisspecification, specify the presence of the stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof. As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items. Expressions such as “at least one of,” whenpreceding a list of elements, modify the entire list of elements and donot modify the individual elements of the list.

As used herein, the term “substantially,” “about,” and similar terms areused as terms of approximation and not as terms of degree, and areintended to account for the inherent variations in measured orcalculated values that would be recognized by those of ordinary skill inthe art. Further, the use of “may” when describing embodiments of theinventive concept refers to “one or more embodiments of the inventiveconcept.” As used herein, the terms “use,” “using,” and “used” may beconsidered synonymous with the terms “utilize,” “utilizing,” and“utilized,” respectively. Also, the term “exemplary” is intended torefer to an example or illustration.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present inventive conceptbelongs. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand/or the present specification, and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a schematic flowchart of a method of manufacturing an organiclight-emitting display apparatus, according to an embodiment.

Referring to FIG. 1, the method of manufacturing the organiclight-emitting display apparatus includes forming a lift-off layer on asubstrate including a first electrode, the lift-off layer including afluorine polymer (e.g., a fluoropolymer) (S10), forming a pattern layerof a certain shape on the lift-off layer (S20), exposing the firstelectrode by etching the lift-off layer between the pattern layer byusing a first solvent (S30), forming an organic functional layer onupper portions of the first electrode and the pattern layer, the organicfunctional layer including an emission layer (S40), removing theremaining lift-off layer by using a second solvent (S50), and forming asecond electrode on the organic functional layer (S60).

The method of manufacturing the organic light-emitting display apparatusand the organic light-emitting display apparatus 1 manufactured by themethod according to an embodiment will be described in more detail belowwith reference to FIGS. 2 through 6E.

FIG. 2 is a schematic cross-sectional view of the organic light-emittingdisplay apparatus 1 manufactured by the method of FIG. 1. FIG. 3 is aschematic cross-sectional view of a process of forming a plurality ofanodes on a substrate, in the method of FIG. 1 according to anembodiment, FIGS. 4A to 4E are schematic cross-sectional views of afirst unit process in the method of FIG. 1 according to an embodiment,FIGS. 5A to 5E are schematic cross-sectional views of a second unitprocess in the method of FIG. 1 according to an embodiment, and FIGS. 6Ato 6E are schematic cross-sectional views of a third unit process in themethod of FIG. 1 according to an embodiment.

Referring to FIG. 2, the organic light-emitting display apparatus 1manufactured by the method of FIG. 1 includes a plurality of anodesincluding a first anode 101, a second anode 102, and a third anode 103,on a substrate 100. First to third organic functional layers 151, 152,and 153, each including an emission layer, are located respectively onthe first to third anodes 101, 102, and 103. A cathode 180 is disposedon the first to third organic functional layers 151, 152, and 153.

As will be described later, during the process of forming the first tothird organic functional layers 151, 152, and 153 on the first to thirdanodes 101, 102, and 103, a pattern layer 130 (e.g., see FIG. 4D)including a non-fluorine based resin and formed by a printing method ona lift-off layer 120 (e.g., see FIG. 4D) including a fluoropolymerhaving a low surface energy may function as a deposition mask. Inaddition, a boundary of the pattern layer 130 (e.g., see FIG. 4D) havingpoor spreadability may not be uniform, but may be rough. Because thepattern layer 130 (e.g., see FIG. 4D) functions as a deposition mask, arough shape of the boundary of the pattern layer 130 may affect patternsof the first to third organic functional layers 151, 152, and 153.Consequently, the boundaries of the first to third organic functionallayers 151, 152, and 153 may be formed to be rougher than those of thefirst to third anodes 101, 102, and 103.

Referring to FIG. 3, the plurality of anodes including the first tothird anodes 101, 102, and 103 are formed on the substrate 100.

The substrate 100 may include various materials. For example, thesubstrate 100 may include a glass material or a plastic material. Theplastic material may include a material having excellent heat-resistingproperty and durability, such as polyimide, polyethylenenaphthalate,polyethyleneterephthalate, polyarylate, polycarbonate, polyetherlmide,and/or polyethersulfone.

Although not shown in FIG. 3, a buffer layer for providing a flatsurface on the substrate 100 and for preventing impurity elements frominfiltrating into the substrate 100 may be further provided. The bufferlayer may have a single-layered structure or a multi-layered structureincluding silicon nitride and/or silicon oxide.

The first to third anodes 101, 102, and 103 are hole injectionelectrodes, and may include a material having a large work function. Thefirst to third anodes 101, 102, and 103 may each include at least oneselected from the group consisting of indium tin oxide, indium zincoxide, zinc oxide, indium oxide, indium gallium oxide, and aluminiumzinc oxide.

Although not shown in FIG. 3, the first to third anodes 101, 102, and103 may be electrically connected to first to third thin filmtransistors located between the substrate 100 and the first to thirdanodes 101, 102, and 103, respectively.

Referring to FIG. 4A, a lift-off layer 120 including a fluoropolymer isformed over the substrate 100, on which the first to third anodes 101,102, and 103 are formed.

The fluoropolymer included in the lift-off layer 120 may include apolymer containing fluorine of about 20 wt % to about 76 wt %. Forexample, the fluoropolymer included in the lift-off layer 120 mayinclude polytetrafluoroethylene, polychlorotrifluoroethylene,polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene anddicholorodifluoroethylene, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, and/or a copolymer of chlorotrifluoroethyleneand perfluoroalkylvinylether.

If an amount of fluorine in the fluoropolymer is less than 20 wt %, thefluoropolymer is not soluble in a fluorine-based solvent, and thus, afluorine-based resin for forming the lift-off layer 120 may not befabricated. In addition, the amount of fluorine in the fluoropolymer maynot exceed 76 wt %, because an amount of fluorine in Teflon that has thelargest amount of fluorine among fluoropolymers is not greater than 76wt %. In the embodiment, the lift-off layer 120 shows excellenttolerance with respect to an organic solvent and excellent solubilitywith respect to the fluorine-based solvent, when the fluoropolymercontains fluorine within a range of about 60 wt % to about 70 wt %.

The lift-off layer 120 may be formed on the substrate 100 by using anapplication method, a printing method, or a deposition method. When thelift-off layer 120 is formed by the application method or the printingmethod, a patterning process may be performed after performing ahardening process and a polymerization process, if desired.

The lift-off layer 120 may be formed to a thickness of 0.2 μm to 5 μm.If the lift-off layer 120 is too thick, a time taken to melt thelift-off layer 120 for performing the patterning increases, therebyincreasing a time for performing the manufacturing processes. If thelift-off layer 120 is too thin, it is difficult to lift off the lift-offlayer 120.

Referring to FIG. 4B, a pattern layer 130 having a shape (e.g., a set orpredetermined shape) is formed on the lift-off layer 120.

The pattern layer 130 may not be formed at (e.g., on) a first region 131corresponding to the first anode 101, but may be formed at (e.g., on) aremaining region 136 except the first region 131.

The pattern layer 130 may include a material having a greater surfaceenergy than that of the lift-off layer 120.

In an embodiment, the pattern layer 130 may include a non-fluorine basedpolymer. For example, the pattern layer 130 may include a composite inwhich a binder material not containing fluorine, such as an acryl-basedresin, a styrene-based resin, a novolac resin, and/or a silicon resin,is melted in a non-fluorine based general organic solvent.

In another embodiment, the pattern layer 130 may include a materialcontaining a small amount of fluorine. For example, the pattern layer130 may include a composite, in which a fluorine-based polymercontaining less than 20 wt % of fluorine is melted in a non-fluorinebased general organic solvent.

The pattern layer 130 may be formed by a printing method.

FIG. 4B shows an example in which the pattern layer 130 is printed onthe lift-off layer 120 by directly dropping droplets J1, J2, and J3 froman inkjet printing device S including a plurality of nozzles N1, N2, andN3.

FIG. 4B illustrates that the droplets J1, J2, and J3 are concurrently(e.g., simultaneously) dropped onto first and second pixel regions PX1and PX2 from the inkjet printing device S to form the pattern layer 130,but the inventive concept is not limited thereto. For example, theinkjet printing device S may form the pattern layer 130 first on thefirst pixel region PX1, and then may move to the second pixel region PX2to form the pattern layer 130. Also, the number, size, and shape of thenozzles provided in the inkjet printing device S may be varied, and aninjecting speed of the droplets dropped from the nozzles may beadjusted.

In a case where the pattern layer 130 of the set or predetermined shapeis directly formed on the lift-off layer 120 by the printing method,because the lift-off layer 120 including the fluoropolymer has lowsurface energy, the pattern layer 130 does not spread over the lift-offlayer 120 but maintains or substantially maintains a set orpredetermined pattern, even when the pattern layer 130 including thenon-fluorine based resin or the polymer containing a small amount offluorine is directly printed on the lift-off layer 120.

If the pattern layer 130 is formed by a photolithography method, aphotoresist is applied on the lift-off layer 120, the photoresist isexposed via a photomask by using an exposure device, and the exposedphotoresist is developed and stripped. Accordingly, when using thephotolithography method, complicated manufacturing processes areperformed. However, according to an embodiment, the non-fluorine basedpolymer may be a general polymer that is not expensive, and thus, maycost less than the photoresist. In addition, when the photolithographymethod is performed, an expensive apparatus is used and complicatedmanufacturing processes are performed. However, the printing methodaccording to an embodiment may use a simplified device and may performstraightforward manufacturing processes, and accordingly, equipmentinvestment costs and processing costs may be reduced. Also, when thephotolithography process is performed, the pattern layer 130 may bepartially lost through the exposure, developing, and strippingprocesses, whereas the printing method according to an embodiment maydirectly form the pattern layer 130 on a region where the pattern is tobe formed (e.g., the region 136, except the first region 131), and thus,loss of material may be prevented or reduced, and manufacturing costsmay be reduced.

Although not shown in FIG. 4B, after performing the printing process ofthe pattern layer 130, a process of drying the pattern layer 130 may beperformed. After printing the pattern layer 130, a temperature and atime for drying the pattern layer 130 may be dependent upon a glasstransition temperature Tg of the fluoropolymer included in the lift-offlayer 120, a boiling point of the solvent included in the lift-off layer120, and/or a wet film thickness. In an embodiment, under a conditionwhere the glass transition temperature Tg of the fluoropolymer is about75° C., the boiling point of the solvent (e.g., PGMEA) is about 150° C.,and the wet film thickness after the printing process is about 10 μm,the pattern layer 130 is dried for about 3 to 6 minutes at a temperatureof about 70° C. to about 80° C.

Referring to FIG. 4C, the lift-off layer 120 is etched by using thepattern layer 130 formed by the process illustrated in FIG. 4B as anetching mask.

An etchant may be a first solvent including fluorine. Because thelift-off layer 120 includes the fluoropolymer and the pattern layer 130includes the non-fluorine based polymer, the pattern layer 130 mayfunction as the etching mask during the etching process using the firstsolvent including the fluorine.

The first solvent may include hydrofluoroether. The hydrofluoroether isan electrochemically stabilized material that rarely interacts withother materials, and is also an eco-friendly material having a lowglobal warming potential (GWP) and a low toxicity.

Through the etching process, the lift-off layer 120 formed on a locationcorresponding to the first region 131, that is, on the first anode 101,is etched.

When the lift-off layer 120 is etched, the first solvent including thefluorine forms a first undercut profile UC1 in the lift-off layer 120under an interface between the pattern layer 130 and the first region131.

The first undercut profile UC1 may allow a first organic functionallayer 151 to be precisely deposited in a deposition process that will bedescribed later, and may remove the lift-off layer 120 remaining on thesubstrate 100 clearly in a lift-off process that will be describedlater.

Referring to FIG. 4D, the first organic functional layer 151 including afirst organic emission layer is formed on the structure shown in FIG.4C.

The first organic functional layer 151 may further include a holeinjection layer, a hole transport layer, an electron transport layer,and/or an electron injection layer.

In an embodiment, the first organic emission layer is used as an exampleof the first organic function layer 151. Hereinafter, the first organicfunctional layer and the first organic emission layer may be denoted bythe same reference numeral.

The first organic functional layer 151 may be formed by a vacuumdeposition process. In the deposition process, the lift-off layer 120and the pattern layer 130 function as a mask. A part of the firstorganic emission layer 151 is formed over the first anode 101, andanother part of the first organic emission layer 151 is formed on theother region 136 of the pattern layer 130, except the first region 131.

Referring to FIG. 4E, a lift-off process is performed on the structureshown in FIG. 4D.

Because the lift-off layer 120 includes the fluoropolymer, a secondsolvent including fluorine is used in the lift-off process. In addition,because the lift-off process is performed after forming the firstorganic emission layer 151, the second solvent may include a materialhaving a low degree of reactivity with the first organic emission layer151. The second solvent may include, for example, hydrofluoroether likethe first solvent.

By lifting off the lift-off layer 120 formed under the region 136 (seeFIG. 4D) of the pattern layer 130, the first organic layer 151 formed onthe region 136 (see FIG. 4D) of the pattern layer 130 is removed, andthe first organic emission layer 151 formed on the first anode 101remains as a pattern.

FIG. 11A is a schematic diagram of boundary lines L151 of the firstorganic emission layer, which are irregularly formed, after finishing afirst unit process. The pattern layer 130 (see FIG. 4D) formed on thelift-off layer 120 (see FIG. 4D) having a low surface energy has poorspreadability, and thus, boundary lines of the pattern layer 130 (seeFIG. 4D) are not uniform, but irregularly formed. Because the patternlayer 130 (see FIG. 4D) functions as a deposition mask, the irregularshape of the boundary lines of the pattern layer 130 may affect thepattern of the first organic emission layer 151. Therefore, the boundarylines L151 of the first organic emission layer 151 are irregularlyformed while generating fine waves. The boundary lines L151 of the firstorganic emission layer 151 may be more irregular than the boundary linesL101 of the first anode 101 formed by the photolithography method.

According to an embodiment, in the process of forming the first organicemission layer 151, a metal mask having openings is not used, but thelift-off process is performed. Thus, misalignment between the substrate100 and the metal mask may be prevented.

After performing the first unit process, a second unit process forforming a second organic emission layer 152 (e.g., see FIG. 5E) foremitting light of a different color from that of the first organicemission layer 151 is performed on a region where the second anode 102is located. Hereinafter, the second unit process will be described inmore detail below with reference to FIGS. 5A to 5E.

Referring to FIG. 5A, the lift-off layer 120 including fluoropolymer isformed over the substrate 100, on which the first to third anodes 101,102, and 103 are formed.

The lift-off layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first unit process. Thelift-off layer 120 may be formed on the substrate 100 by an applicationmethod, a printing method, or a deposition method.

Referring to FIG. 5B, the pattern layer 130 is formed on the lift-offlayer 120.

The pattern layer 130 including a non-fluorine based polymer is notformed at (e.g., on) a second region 132 corresponding to the secondanode 102, but is directly formed at (e.g., on) a region 137 other thanthe second region 132 by dropping droplets J1, J2, and J3 from an inkjetprinting device S including the plurality of nozzles N1, N2, and N3.

A process of drying the pattern layer 130 may be further performed afterthe printing process of the pattern layer 130.

Referring to FIG. 5C, the lift-off layer 120 is etched by using thepattern layer 130 of a set or predetermined shape formed by the printingprocess illustrated with reference to FIG. 5B as an etching mask.

An etchant may be the first solvent including fluorine. Because thelift-off layer 120 includes the fluoropolymer and the pattern layer 130includes the non-fluorine based polymer, the pattern layer 130 mayfunction as an etching mask in the etching process using the firstsolvent including the fluorine.

The first solvent may include hydrofluoroether. Otherwise, the firstsolvent may include a different material from that of the first unitprocess described above.

According to the etching process, the lift-off layer 120 correspondingto the second region 132, that is, the lift-off layer 120 formed on thesecond anode 102, is etched.

In addition, when the lift-off layer 120 is etched, the first solventincluding the fluorine forms a second undercut profile UC2 in thelift-off layer 120 under a boundary of the second region 132.

Referring to FIG. 5D, a second organic functional layer 152 including asecond organic emission layer is formed over a structure shown in FIG.5C.

The second organic functional layer 152 may further include at least oneof a hole injection layer, a hole transport layer, an electron transportlayer, and an electron injection layer.

In an embodiment, the second organic emission layer is described as anexample of the second organic functional layer 152. Hereinafter, thesecond organic functional layer and the second organic emission layermay be denoted by the same reference numeral.

The second organic emission layer 152 may be formed by a vacuumdeposition process. In the deposition process, the lift-off layer 120and the pattern layer 130 may function as a mask. A part of the secondorganic emission layer 152 is formed on the second anode 102, andanother part of the second organic emission layer 152 is formed on theregion 137 other than the second region 132 in the pattern layer 130.

Referring to FIG. 5E, a lift-off process is performed on the structureshown in FIG. 5D.

Because the lift-off layer 120 includes the fluoropolymer, a secondsolvent including fluorine is used in the lift-off process. In addition,because the lift-off process is performed after forming the secondorganic emission layer 152, the second solvent may include a materialhaving a low degree of reactivity with the second organic emission layer152. The second solvent may include, for example, hydrofluoroether likethe first solvent.

By lifting off the lift-off layer 120 formed under the region 137 (seeFIG. 5D) of the pattern layer 130, the second organic emission layer 152formed on the region 137 (see FIG. 5D) of the pattern layer 130 isremoved, and the second organic emission layer 152 formed on the secondanode 102 remains as a pattern.

FIG. 11B is a schematic diagram showing a state, in which boundary linesL152 of the second organic emission layer 152 are irregularly formedafter finishing the second unit process. Because the pattern layer 130(see FIG. 5D) formed on the lift-off layer 120 (see FIG. 5D) having alow surface energy has poor spreadability, boundary lines of the patternlayer 130 (see FIG. 5D) are not uniform, but are irregularly formed.Because the pattern layer 130 (see FIG. 5D) functions as a depositionmask, the irregular shape of the boundary lines of the pattern layer 130affects the pattern of the second organic emission layer 152. Therefore,boundary lines L152 of the second organic emission layer 152 areirregularly formed as, for example, fine waves. The boundary lines L152of the second organic emission layer 152 may be formed to be moreirregular than the boundary lines L102 of the second anode 102 that isformed by the photolithography method.

After performing the second unit process described above, a third unitprocess for forming a third organic emission layer 153 (e.g., see FIG.6E) for emitting light of a different color from those of the first andsecond organic emission layers 152 and 152 is performed. Hereinafter,the third unit process will be described below with reference to FIGS.6A through 6E.

Referring to FIG. 6A, the lift-off layer 120 including fluoropolymer isformed over the substrate 100 on which the first to third anodes 101,102, and 103 are formed.

The lift-off layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first unit process and/orthe second unit process. The lift-off layer 120 may be formed on thesubstrate 100 by an application method, a printing method, or adeposition method.

Referring to FIG. 6B, the pattern layer 130 is formed on the lift-offlayer 120.

The pattern layer 130 including a non-fluorine based polymer is notformed at (e.g., on) a third region 133 corresponding to the third anode103, but is directly formed at (e.g., on) a region 138 other than thethird region 133, by dropping droplets J1, J2, and J3 from the inkjetprinting device S including the plurality of nozzles N1, N2, and N3.

A process for drying the pattern layer 130 may be further performedafter the printing process of the pattern layer 130.

Referring to FIG. 6C, the lift-off layer 120 is etched by using thepattern layer 130 having a set or predetermined shape formed by theprinting method illustrated in FIG. 6B as an etching mask.

An etchant may include the first solvent including fluorine. Because thelift-off layer 120 includes the fluoropolymer and the pattern layer 130includes the non-fluorine based polymer, the pattern layer 130 mayfunction as the etching mask in the etching process using the firstsolvent including the fluorine.

The first solvent may include hydrofluoroether, like in the first unitprocess and/or the second unit process. The first solvent may include amaterial different from those of the first unit process and the secondunit process.

Due to the etching process, the lift-off layer 120 corresponding to thethird region 133, that is, the lift-off layer 120 formed on the thirdanode 103, is etched.

In addition, when the lift-off layer 120 is etched, the first solventincluding the fluorine forms a third undercut profile UC3 in thelift-off layer 120 under a boundary surface of the third region 133 inthe pattern layer 130.

Referring to FIG. 6D, a third organic functional layer 153 including athird organic emission layer is formed on the structure shown in FIG.6C.

The third organic functional layer 153 may further include at least oneof a hole injection layer, a hole transport layer, an electron transportlayer, and an electron injection layer.

In an embodiment, the third organic emission layer is described as anexample of the third organic functional layer 153. Hereinafter, thethird organic functional layer and the third organic emission layer maybe denoted by the same reference numeral.

The third organic emission layer 153 may be formed by a vacuumdeposition process. In the deposition process, the lift-off layer 120and the pattern layer 130 may function as a mask. A part of the thirdorganic emission layer 153 is formed on the third anode 103, and anotherpart of the third organic emission layer 153 is formed on a region 138other than the third region 133 in the pattern layer 130.

Referring to FIG. 6E, a lift-off process is performed on the structureshown in FIG. 6D.

Because the lift-off layer 120 includes the fluoropolymer, the secondsolvent including the fluorine is used in the lift-off process. Inaddition, since the lift-off process is performed after forming thethird organic emission layer 153, the second solvent may include amaterial having a low degree of reactivity with the third organicemission layer 153. The second solvent may include hydrofluoroether,like the first solvent.

By lifting off the lift-off layer 120 formed under the region 138 (seeFIG. 6D) of the pattern layer 130, the third organic emission layer 153formed on the region 138 (see FIG. 6D) of the pattern layer 130 isremoved, and the third organic emission layer 153 formed on the thirdanode 103 remains as a pattern.

FIG. 11C is a schematic diagram showing a state in which boundary linesL153 of the third organic emission layer 153 are irregularly formedafter finishing the third unit process. Because the pattern layer 130(see FIG. 6D) formed on the lift-off layer 120 (see FIG. 6D) having alow surface energy has poor spreadability, boundary lines of the patternlayer 130 (see FIG. 6D) are not uniform, but are irregularly formed.Because the pattern layer 130 (see FIG. 6D) functions as a depositionmask, the irregular shape of the boundary lines of the pattern layer 130affects the pattern of the third organic emission layer 153. Therefore,boundary lines L153 of the third organic emission layer 153 areirregularly formed as, for example, fine waves. The boundary lines L153of the third organic emission layer 153 may be formed to be moreirregular than the boundary lines L103 of the third anode 103 that isformed by the photolithography method.

Referring back to FIG. 2, the first to third organic functional layers151, 152, and 153 are formed through the first to third unit processesdescribed above, respectively, and then, a cathode 180 is formed as acommon layer.

In FIG. 2, the cathode 180 is shown as not integrally formed, butseparately formed on the first to third anodes 101, 102, and 103.However, the inventive concept is not limited thereto, and in someembodiments, the cathode 180 may be integrally formed.

In an embodiment, the first to third anodes 101, 102, and 103 aredescribed as hole injection electrodes, and the cathode 180 is describedas an electron injection electrode, but the inventive concept is notlimited thereto. That is, the electron injection electrodes may beformed on regions where the first to third anodes 101, 102, and 103 arelocated, and the hole injection electrode may be formed on a regionwhere the cathode 180 is located.

The first to third organic emission layers 151, 152, and 153 may emitlight of different colors from each other. The light emitted from thefirst to third organic emission layers 151, 152, and 153 may be mixedwith each other to form white light. For example, the first to thirdorganic emission layers 151, 152, and 153 may respectively emit redlight, green light, and blue light. For example, the first to thirdorganic emission layers 151, 152, and 153 may be sub-pixels configuringa unit pixel in the organic light-emitting display apparatus 1.

The organic light-emitting display apparatus 1 shown in FIG. 2 maydenote one unit pixel (e.g., two one unit pixels). Also, the abovedescribed methods may be applied to an organic light-emitting displayapparatus including a plurality of unit pixels as shown in FIG. 2. Thatis, a plurality of first organic emission layers 151 for emitting firstcolor light may be formed concurrently (e.g., simultaneously) throughthe first unit process. A plurality of second organic emission layers152 for emitting second color light may be concurrently (e.g.,simultaneously) formed through the second unit process. A plurality ofthird organic emission layers 153 for emitting third color light may beconcurrently (e.g., simultaneously) formed through the third unitprocess. Full-color light may be implemented through the first to thirdunit processes.

FIG. 7 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 2 manufactured by a manufacturing method according toan embodiment.

The organic light-emitting display apparatus 2 illustrated withreference to FIG. 7 may be manufactured in a similar manner to that ofthe organic light-emitting display apparatus 1 of FIG. 2. Hereinafter,differences between the method for manufacturing the organiclight-emitting display apparatus 1 of FIG. 2 and the method formanufacturing the organic light-emitting display apparatus 2 of FIG. 7will be described in more detail below.

Referring to FIG. 7, a plurality of anodes including first to thirdanodes 101, 102, and 103 are formed on the substrate 100, and a pixeldefining layer 110 is formed on the substrate 100 to surround edges ofthe first to third anodes 101, 102, and 103. The pixel defining layer110 defines an emission area, and prevents or substantially preventsshort-circuit between each of the first to third anodes 101, 102, and103 and the cathode 180.

In an embodiment, first to third unit processes are performed afterforming the first to third anodes 101, 102, and 103 and the pixeldefining layer 110.

Through the first to third unit processes, the first to third organicemission layers 151, 152, and 153 are formed on the first to thirdanodes 101, 102, and 103, respectively. After performing the first tothird unit processes, the cathode 180 is formed as a common layer.

The pixel defining layer 180 may be formed by a photolithographyprocess. As in the above-described embodiments, because the patternlayer 130 (e.g., see FIGS. 4D, 5D, and 6D) functions as the depositionmask, the irregular shape at the boundary of the pattern layer 130affects the patterns of the first to third organic functional layers151, 152, and 153. Therefore, the boundary lines of the first to thirdorganic functional layers 151, 152, and 153 may be more irregular thanthose of the first to third anodes 101, 102, and 103 and the pixeldefining layer 110.

FIG. 8 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 3 manufactured by a manufacturing method according toan embodiment.

The organic light-emitting display apparatus 3 of FIG. 8 may bemanufactured in a similar manner to that of the organic light-emittingdisplay apparatus 2 shown in FIG. 7 described above. Hereinafter,differences between the method of manufacturing the organiclight-emitting display apparatus 2 illustrated with reference to FIG. 7and the method of manufacturing the organic light-emitting displayapparatus 3 illustrated with reference to FIG. 8 will be describedbelow.

Referring to FIG. 8, a plurality of anodes including first to thirdanodes 101, 102, and 103 are formed on the substrate 100, and a pixeldefining layer 110 is formed on the substrate 100 to surround edges ofthe first to third anodes 101, 102, and 103. The pixel defining layer110 defines an emission area, and prevents or substantially preventsshort-circuit between each of the first to third anodes 101, 102, and103 and the cathode 180.

In an embodiment, first to third unit processes are performed afterforming the first to third anodes 101, 102, and 103 and the pixeldefining layer 110.

In the first unit process, the lift-off layer 120 (e.g., see FIG. 4D)formed on the first anode 101 is etched by using the printing method andthe etching process. Next, the first organic emission layer 151 isformed on the first anode 101 by a deposition process. When the firstorganic emission layer 151 is formed, a first auxiliary cathode 181 isformed successively on the first organic emission layer 151, and then, alift-off process is performed.

In the lift-off process, a second solvent including fluorine is used.The second solvent including the fluorine may break the first organicemission layer 151. The first auxiliary cathode 181 functions as abarrier for protecting the first organic emission layer 151 during thelift-off process.

After performing the first unit process, the second unit process isperformed. The lift-off layer 120 (e.g., see FIG. 5D) on the secondanode 102 is etched by using the printing method and the etchingprocess. Next, the second organic emission layer 152 is formed on thesecond anode 102 by a deposition process. When the second organicemission layer 152 is formed, a second auxiliary cathode 182 issuccessively formed on the second organic emission layer 152, and thelift-off process is performed.

In the lift-off process, the second solvent including fluorine is used.The second solvent may break the second organic emission layer 152. Thesecond auxiliary cathode 182 functions as a barrier for protecting thesecond organic emission layer 152 during the lift-off process.

After the second unit process, the third unit process is performed. Thelift-off layer 120 (e.g., see FIG. 6D) on the third anode 103 is etchedby using the printing method and the etching process. Next, the thirdorganic emission layer 153 is formed on the third anode 103 by adeposition process. When the third organic emission layer 153 is formed,a third auxiliary cathode 183 is successively formed on the thirdorganic emission layer 153, and the lift-off process is performed.

In the lift-off process, a second solvent including fluorine is used.The second solvent including the fluorine may damage the third organicemission layer 153. The third auxiliary cathode 183 functions as abarrier for protecting the third organic emission layer 183 during thelift-off process.

After performing the first to third unit processes, the cathode 180 isformed as a common layer.

According to a manufacturing method illustrated with reference to FIG.8, when the first to third organic emission layers 151, 152, and 153 areformed, the first to third auxiliary cathodes 181, 182, and 183 aresuccessively formed on the first to third organic emission layers 151,152, and 153, respectively, in order to prevent or reduce damage to thefirst to third organic emission layers 151, 152, and 153 in the postlift-off process. Thereafter, the first to third auxiliary cathodes 181,182, and 183 are electrically connected to the cathode 180 that iscommonly formed throughout the plurality of pixels after the first tothird unit processes, in order to prevent or reduce a voltage droppingof the cathode 180.

FIGS. 9A and 9B are schematic cross-sectional views of a method offorming a pattern layer according to an embodiment.

In FIG. 9A, a first pattern layer 131 is formed on the lift-off layer120 by dropping droplets J1 and J3 including a material having a greatersurface energy than that of the lift-off layer 120 from the inkjetprinting device S including the plurality of nozzles N1, N2, and N3.

In FIG. 9B, a second pattern layer 132 is formed on the lift-off layer120 by dropping a droplet J2 including a material having a smallersurface energy than that of the first pattern layer 131 from the inkjetprinting device S including the plurality of nozzles N1, N2, and N3.

Referring to FIGS. 9A and 9B, the first pattern layer 131 including thematerial having the greater surface energy than that of the lift-offlayer 120 is formed first, and then the second pattern layer 132including the material having the smaller surface energy than that ofthe first pattern layer 131 is formed thereafter.

The first pattern layer 131 includes a non-fluorine based polymer, andthe second pattern layer 132 may include a material, in which afluorine-based surfactant is added to the non-fluorine based polymermaterial of the first pattern layer 131. For example, the second patternlayer 132 may include non-ionic polymeric fluorosurfactant.

The first pattern layer 131 having the greater surface energy maysurround the second pattern layer 132 having the smaller surface energy.

As in one or more of the above-described embodiments, when the patternlayer 130 (e.g., see FIG. 4B) of a set or predetermined shape isdirectly formed on the lift-off layer 120 by the printing method, evenif the pattern layer 130 including the non-fluorine based resin or thepolymer having a small amount of fluorine is directly printed on thelift-off layer 120, the pattern layer 130 does not spread over thelift-off layer 120, but maintains or substantially maintains a set orpredetermined pattern, because the lift-off layer 120 including thefluoropolymer has a low surface energy. However, because the patternlayer 130 does not spread, uniformity of the pattern layer 130 degrades.

However, since the first pattern layer 131 having a high surface energyis formed according to the method illustrated in FIGS. 9A and 9C, theuniformity of the pattern layer may be improved, and a pin hole defectthat may occur in a surface of the pattern layer may be prevented orreduced.

FIG. 10 is a schematic cross-sectional view of a method of forming apattern layer according to an embodiment.

FIG. 10 illustrates that the first pattern layer 131 and the secondpattern layer 132 are concurrently (e.g., simultaneously) formed on thelift-off layer 120 by using the inkjet printing device S including theplurality of nozzles N1, N2, and N3. For example, droplets J1 and J3including a material having a large surface energy are dropped via thenozzles N1 and N3 to form the first pattern layer 131, and concurrently(e.g., simultaneously or at the same time), a droplet J2 including amaterial having a small surface energy is dropped via the nozzle N2 toform the second pattern layer 132. Thus, processing speed may be fasterthan that of the method illustrated in FIGS. 9A and 9B.

In addition, although not shown in the drawings, one or more of theorganic light-emitting display apparatuses described above may furtherinclude an encapsulation member for encapsulating the organic emissionlayer. The encapsulation member may include a glass substrate, a metalfoil, or a thin film encapsulation layer in which an inorganic layer andan organic layer are mixed.

According to the one or more embodiments, an organic light-emittingdisplay apparatus may be manufactured through straightforwardmanufacturing processes, and a misalignment between the patterns may beprevented or substantially prevented. Also, costs for providingequipment and performing manufacturing processes, and material costs,may be reduced, and thus, manufacturing costs may be reduced.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only, and not for purposes oflimitation. Descriptions of features and/or aspects within eachembodiment should typically be considered as available for other similarfeatures and/or aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims,and their equivalents.

What is claimed is:
 1. An organic light-emitting display apparatuscomprising: a substrate; a plurality of first thin film transistors anda plurality of second thin film transistors arranged on the substrate; aplurality of first anodes on the substrate, the plurality of firstanodes being spaced apart from each other along a first direction, andeach of the plurality of first anodes being electrically connected to acorresponding one of the plurality of first thin film transistors; aplurality of second anodes on the substrate, the plurality of secondanodes being spaced apart from the plurality of first anodes in a seconddirection that intersects with the first direction, the plurality ofsecond anodes being spaced apart from each other along the firstdirection, and each of the plurality of second anodes being electricallyconnected to a corresponding one of the plurality of second thin filmtransistors; a pixel defining layer surrounding edges of both theplurality of first anodes and the plurality of second anodes; a firstorganic functional layer continuously arranged in the first direction onthe plurality of first anodes and on the pixel defining layer betweenthe plurality of first anodes, the first organic functional layercomprising a first emission layer; a second organic functional layercontinuously arranged in the first direction on the plurality of secondanodes and on the pixel defining layer between the plurality of secondanodes, the second organic functional layer comprising a second emissionlayer; a first auxiliary cathode on the first organic functional layer;and a second auxiliary cathode on the second organic functional layer,wherein the first auxiliary cathode is spaced apart from the secondauxiliary cathode in the second direction.
 2. The organic light-emittingdisplay apparatus of claim 1, wherein the first organic functional layeris spaced apart from the second organic functional layer in the seconddirection.
 3. The organic light-emitting display apparatus of claim 2,wherein in a plan view, the first organic functional layer is arrangedsubstantially parallel to the second organic functional layer.
 4. Theorganic light-emitting display apparatus of claim 2, wherein in a planview, each of the first and second organic functional layers has twoboundary lines extending in the first direction.
 5. The organiclight-emitting display apparatus of claim 4, wherein each of the twoboundary lines has a wavy shape.
 6. The organic light-emitting displayapparatus of claim 2, wherein in a plan view, each of the first andsecond organic functional layers has a first width and a second widthsmaller than the first width, the first width is a width of each of thefirst and second organic functional layers along the first direction,and the second width is a width of each of the first and second organicfunctional layers along the second direction.
 7. The organiclight-emitting display apparatus of claim 1, wherein each of the firstand second organic functional layers further comprises a hole injectionlayer, a hole transport layer, an electron transport layer, and/or anelectron injection layer.
 8. The organic light-emitting displayapparatus of claim 1, wherein the first emission layer comprises a firstorganic emission layer, the second emission layer comprises a secondorganic emission layer, and a first color emitted from the firstemission layer is different from a second color emitted from the secondemission layer.
 9. The organic light-emitting display apparatus of claim8, further comprising: a plurality of third thin film transistorsarranged on the substrate; a plurality of third anodes on the substrate,the plurality of third anodes being spaced apart from each of theplurality of first and second anodes in the second direction, theplurality of third anodes being spaced apart from each other along thefirst direction, and each of the plurality of third anodes beingelectrically connected to a corresponding one of the plurality of thirdthin film transistors; a third organic functional layer continuouslyarranged in the first direction on the plurality of third anodes and onthe pixel defining layer between the plurality of third anodes, thethird organic functional layer comprising a third emission layer; and athird auxiliary cathode on the third organic functional layer, the thirdauxiliary cathode being spaced apart from the first auxiliary cathodeand the second auxiliary cathode in the second direction, wherein athird color emitted from the third emission layer is different from eachof the first and second colors emitted from the first and secondemission layers.
 10. The organic light-emitting display apparatus ofclaim 9, wherein the first, second and third colors are mixed togenerate white light.
 11. The organic light-emitting display apparatusof claim 1, further comprising a second electrode integrally formed onthe first and second auxiliary cathodes.
 12. An organic light-emittingdisplay apparatus comprising: a substrate; a plurality of first thinfilm transistors and a plurality of second thin film transistorsarranged on the substrate; a plurality of first anodes on the substrate,the plurality of first anodes being spaced apart from each other along afirst direction, and each of the plurality of first anodes beingelectrically connected to a corresponding one of the plurality of firstthin film transistors; a plurality of second anodes on the substrate,the plurality of second anodes being spaced apart from the plurality offirst anodes in a second direction that intersects with the firstdirection, and the plurality of second anodes being spaced apart fromeach other along the first direction, and each of the plurality ofsecond anodes being electrically connected to a corresponding one of theplurality of second thin film transistors; a pixel defining layersurrounding edges of both the plurality of first anodes and theplurality of second anodes; a first organic functional layercontinuously arranged in the first direction on the plurality of firstanodes and on the pixel defining layer between the plurality of firstanodes, the first organic functional layer comprising a first emissionlayer; a second organic functional layer continuously arranged in thefirst direction on the plurality of second anodes and on the pixeldefining layer between the plurality of second anode, the second organicfunctional layer comprising a second emission layer; and a secondelectrode overlapping the first and second organic functional layers andthe pixel defining layer, wherein the first organic functional layer isspaced apart from the second organic functional layer in the seconddirection.
 13. The organic light-emitting display apparatus of claim 12,wherein in a plan view, the first organic functional layer is arrangedsubstantially parallel to the second organic functional layer.
 14. Theorganic light-emitting display apparatus of claim 12, wherein in a planview, each of the first and second organic functional layers has twoboundary lines extending in the first direction.
 15. The organiclight-emitting display apparatus of claim 14, wherein each of the twoboundary lines has a wavy shape.
 16. The organic light-emitting displayapparatus of claim 12, wherein in a plan view, each of the first andsecond organic functional layers has a first width and a second widthsmaller than the first width, the first width is a width of each of thefirst and second organic functional layers along the first direction,and the second width is a width of each of the first and second organicfunctional layers along the second direction.
 17. The organiclight-emitting display apparatus of claim 12, wherein each of the firstand second organic functional layers further comprises a hole injectionlayer, a hole transport layer, an electron transport layer, and/or anelectron injection layer.
 18. The organic light-emitting displayapparatus of claim 12, wherein the first emission layer comprises afirst organic emission layer, the second emission layer comprises asecond organic emission layer, and a first color emitted from the firstemission layer is different from a second color emitted from the secondemission layer.
 19. The organic light-emitting display apparatus ofclaim 18, further comprising: a plurality of third thin film transistorsarranged on the substrate; a plurality of third anodes on the substrate,the plurality of third anodes being spaced apart from each of theplurality of first and second anodes in the second direction, theplurality of third anodes being spaced apart from each other along thefirst direction, and each of the plurality of third anodes beingelectrically connected to a corresponding one of the plurality of thirdthin film transistors; and a third organic functional layer continuouslyarranged in the first direction on the plurality of third anodes and onthe pixel defining layer between the plurality of third anodes, thethird organic functional layer comprising a third emission layer,wherein the second electrode overlaps third organic functional layersand the pixel defining layer surrounding edges of the plurality of thirdanodes, wherein a third color emitted from the third emission layer isdifferent from each of the first and second colors emitted from thefirst and second emission layers.
 20. The organic light-emitting displayapparatus of claim 19, wherein the first, second and third colors aremixed to generate white light.